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北京研華興業電子科技有限公司（研華科技）

EPC-B2275

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更新時間：2023-03-18 16:39:45瀏覽次數：251次

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基于Intel 第六代/第七代Core™ 桌面級 i3/i5/i7處理器嵌入式工控機，搭載Q170芯片組

規格 下載規格表

  • Part Number
  • 相關訊息
Rear I/O
  • HD Audio
  • USB 3.0
  • Ethernet
  • HDMI / DisplayPort*
  • VGA
  • Serial
  • DC Power Jack
  • Line in, Line out, Mic in
  • Line in, Line out, Mic in
  • 4 (USB3.0)
  • 4 (USB3.0)
  • 2 (10/100/1000Mbps)
  • 2 (10/100/1000Mbps)
  • 1
  • 1
  • 1
  • 1
  • 1 (RS-232, supports 5V/12V)
  • 1 (RS-232, supports 5V/12V)
  • 1
  • 1
Memory
  • Socket
  • Max. Capacity
  • Technology
  • 2 x 260 Pin DDR4 SO-DIMM
  • 2 x 260 Pin DDR4 SO-DIMM
  • 32GB (up to 16GB per SO-DIMM)
  • 32GB (up to 16GB per SO-DIMM)
  • Dual Channel DDR4 2133 MHz SDRAM
  • Dual Channel DDR4 2133 MHz SDRAM
Processor
  • CPU
  • Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170
  • Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170
Form Factor
  • Board
  • AIMB-275
  • AIMB-275
Drive Bay
  • Slim ODD and 2.5" HDD
  • 2.5" HDD*2 or 2.5" HDD*1 + slim ODD*1
  • 2.5" HDD*2 or 2.5" HDD*1 + slim ODD*1
Miscellaneous
  • LED Indicators
  • Power Switch
  • Power & HDD
  • Power & HDD
  • 1
  • 1
Expansion
  • PCI Express x 16
  • 1 (maximum:60W for low profile PCIe card)
  • 1 (maximum:60W for low profile PCIe card)
Cooling
  • Fan
  • 1 (7cm/39.45CFM)
  • 2 (7cm/39.45CFM each)
Environment
  • Shock Protection
  • Temperature (Operating)
  • Humidity
  • Temperature (Storage)
  • 10G (with 11ms duration, half sine wave)
  • 10G (with 11ms duration, half sine wave)
  • 0 ~ 40°C (32 ~ 104°F)
  • 0 ~ 40°C (32 ~ 104°F)
  • 10 ~ 85% @ 40° C, non-condensing
  • 10 ~ 85% @ 40° C, non-condensing
  • -20 ~ 60° C (-4 ~ 140° F)
  • -20 ~ 60° C (-4 ~ 140° F)
Physical
  • Dimension (mm)
  • Weight
  • 250 x 98 x 255 mm (10.04" x 3.86" x 9.84")
  • 250 x 98 x 255 mm (10.04" x 3.86" x 9.84")
  • 3.1 kg
  • 3.1 kg
Reserved Opening
  • USB
  • Serial
  • WLAN Antenna
  • Expansion slot
  • 4
  • 4
  • 1 (Front IO)
  • 1 (Front IO)
  • 2
  • 2
  • 1 (low profile)
  • 1 (low profile)

Rear I/O

  • HD Audio

    AIMB-B2275SG-00YE Line in, Line out, Mic in
    AIMB-B2275SG-15ZE Line in, Line out, Mic in

  • USB 3.0

    AIMB-B2275SG-00YE 4 (USB3.0)
    AIMB-B2275SG-15ZE 4 (USB3.0)

  • Ethernet

    AIMB-B2275SG-00YE 2 (10/100/1000Mbps)
    AIMB-B2275SG-15ZE 2 (10/100/1000Mbps)

  • HDMI / DisplayPort*

    AIMB-B2275SG-00YE 1
    AIMB-B2275SG-15ZE 1

  • VGA

    AIMB-B2275SG-00YE 1
    AIMB-B2275SG-15ZE 1

  • Serial

    AIMB-B2275SG-00YE 1 (RS-232, supports 5V/12V)
    AIMB-B2275SG-15ZE 1 (RS-232, supports 5V/12V)

  • DC Power Jack

    AIMB-B2275SG-00YE 1
    AIMB-B2275SG-15ZE 1

Memory

  • Socket

    AIMB-B2275SG-00YE 2 x 260 Pin DDR4 SO-DIMM
    AIMB-B2275SG-15ZE 2 x 260 Pin DDR4 SO-DIMM

  • Max. Capacity

    AIMB-B2275SG-00YE 32GB (up to 16GB per SO-DIMM)
    AIMB-B2275SG-15ZE 32GB (up to 16GB per SO-DIMM)

  • Technology

    AIMB-B2275SG-00YE Dual Channel DDR4 2133 MHz SDRAM
    AIMB-B2275SG-15ZE Dual Channel DDR4 2133 MHz SDRAM

Processor

  • CPU

    AIMB-B2275SG-00YE Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170
    AIMB-B2275SG-15ZE Intel® 7th & 6th Gen Core™ i processor (LGA1151) with Intel Q170

Form Factor

  • Board

    AIMB-B2275SG-00YE AIMB-275
    AIMB-B2275SG-15ZE AIMB-275

Drive Bay

  • Slim ODD and 2.5" HDD

    AIMB-B2275SG-00YE 2.5" HDD*2 or 2.5" HDD*1 + slim ODD*1
    AIMB-B2275SG-15ZE 2.5" HDD*2 or 2.5" HDD*1 + slim ODD*1

Miscellaneous

  • LED Indicators

    AIMB-B2275SG-00YE Power & HDD
    AIMB-B2275SG-15ZE Power & HDD

  • Power Switch

    AIMB-B2275SG-00YE 1
    AIMB-B2275SG-15ZE 1

Expansion

  • PCI Express x 16

    AIMB-B2275SG-00YE 1 (maximum:60W for low profile PCIe card)
    AIMB-B2275SG-15ZE 1 (maximum:60W for low profile PCIe card)

Cooling

  • Fan

    AIMB-B2275SG-00YE 1 (7cm/39.45CFM)
    AIMB-B2275SG-15ZE 2 (7cm/39.45CFM each)

Environment

  • Shock Protection

    AIMB-B2275SG-00YE 10G (with 11ms duration, half sine wave)
    AIMB-B2275SG-15ZE 10G (with 11ms duration, half sine wave)

  • Temperature (Operating)

    AIMB-B2275SG-00YE 0 ~ 40°C (32 ~ 104°F)
    AIMB-B2275SG-15ZE 0 ~ 40°C (32 ~ 104°F)

  • Humidity

    AIMB-B2275SG-00YE 10 ~ 85% @ 40° C, non-condensing
    AIMB-B2275SG-15ZE 10 ~ 85% @ 40° C, non-condensing

  • Temperature (Storage)

    AIMB-B2275SG-00YE -20 ~ 60° C (-4 ~ 140° F)
    AIMB-B2275SG-15ZE -20 ~ 60° C (-4 ~ 140° F)

Physical

  • Dimension (mm)

    AIMB-B2275SG-00YE 250 x 98 x 255 mm (10.04" x 3.86" x 9.84")
    AIMB-B2275SG-15ZE 250 x 98 x 255 mm (10.04" x 3.86" x 9.84")

  • Weight

    AIMB-B2275SG-00YE 3.1 kg
    AIMB-B2275SG-15ZE 3.1 kg

Reserved Opening

  • USB

    AIMB-B2275SG-00YE 4
    AIMB-B2275SG-15ZE 4

  • Serial

    AIMB-B2275SG-00YE 1 (Front IO)
    AIMB-B2275SG-15ZE 1 (Front IO)

  • WLAN Antenna

    AIMB-B2275SG-00YE 2
    AIMB-B2275SG-15ZE 2

  • Expansion slot

    AIMB-B2275SG-00YE 1 (low profile)
    AIMB-B2275SG-15ZE 1 (low profile)

EPC-B2278

Intel Alder Lake platform to suppor

EPC-T4218

THIN 1U Compact size with Intel 8th

EPC-U2117

Intel Atom第六代Apollo Lake無風扇嵌入式工控機，板

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